Inkjet printhead with multi-layer mounting substrate
US8690296B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2012 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Sep 27, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14491
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An inkjet printhead includes a printhead die including: a mounting substrate on which the printhead die is mounted, the mounting substrate including: a base layer including a hole; an intermediate layer including: a first surface including a plurality of contact pads; a second surface opposite the first surface, the second surface being proximate the base layer; and a slot that is aligned with the hole in the base layer; and a face layer proximate the first surface of the intermediate layer, the face layer including a window, wherein the printhead die is disposed within the window such that an ink feed opening of the printhead die is in fluid communication with the slot in the intermediate layer of the mounting substrate; and a plurality of electrical interconnections connecting bond pads of the printhead die to the plurality of contact pads on the intermediate layer of the mounting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.