Methods and apparatus for cleaning deposition chamber parts using selective spray etch
US8691023B2 · kind B2 · utility
116Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2012 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Aug 14, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23G1/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In one aspect, a method of cleaning an electronic device manufacturing process chamber part is provided, including a) spraying the part with an acid; b) spraying the part with DI water; and c) treating the part with potassium hydroxide. Other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.