Patent · US Active

Method for creating a micromechanical membrane structure and MEMS component

US8691611B2 · kind B2 · utility

0Cited by

5References

4Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Arnim Hoechst · Lörrach, DE
Jochen Reinmuth · Reutlingen, DE
Brett Diamond · Pittsburgh, US

Key dates

Filing date	Nov 7, 2011
Grant date	Apr 8, 2014
Priority date	—
Expiry date	Aug 10, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2201/0136
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

In a method for manufacturing a micromechanical membrane structure, a doped area is created in the front side of a silicon substrate, the depth of which doped area corresponds to the intended membrane thickness, and the lateral extent of which doped area covers at least the intended membrane surface area. In addition, in a DRIE (deep reactive ion etching) process applied to the back side of the silicon substrate, a cavity is created beneath the doped area, which DRIE process is aborted before the cavity reaches the doped area. The cavity is then deepened in a KOH etching process in which the doped substrate area functions as an etch stop, so that the doped substrate area remains as a basic membrane over the cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.