Arnim Hoechst
16Patents
3h-index
37Co-inventors
56Inventor score
Filing activity: Dec 20, 2004 → Sep 14, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8698255B2 | Semiconductor component having a micromechanical microphone structure | Electricity | 6 | Active |
| US8089828B2 | Acoustic sensor element | Electricity | 3 | Active |
| US7495302B2 | Micromechanical component having a diaphragm | Performing Operations; Transporting | 3 | Expired |
| US7243551B2 | Micromechanical component having a sealed cavity and at least two dielectric layers and corresponding method for its manufacture | Performing Operations; Transporting | 3 | Expired |
| US8217476B2 | Micromechanical component and method for the manufacture thereof | Performing Operations; Transporting | 2 | Active |
| US8692339B2 | Micromechanical component having a rear volume | Performing Operations; Transporting | 1 | Active |
| US8749013B2 | Sensor and method for its production | Performing Operations; Transporting | 1 | Active |
| US9266721B2 | Eutectic bonding of thin chips on a carrier substrate | Electricity | 1 | Active |
| US9725300B2 | Capacitive MEMS-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodes | Performing Operations; Transporting | 1 | Active |
| US8993356B2 | Method for constructing an electrical circuit, and electrical circuit | Emerging Cross-Sectional Technologies | 0 | Active |
| US8691611B2 | Method for creating a micromechanical membrane structure and MEMS component | Performing Operations; Transporting | 0 | Active |
| US8621929B2 | Manufacturing method for a micromechanical component and micromechanical component | Physics | 0 | Active |
| US10793430B2 | Method for producing thin MEMS wafers | Performing Operations; Transporting | 0 | Active |
| US7435991B2 | Micromechanical sensor | Performing Operations; Transporting | 0 | Expired |
| US11012789B2 | MEMS microphone system | Electricity | 0 | Active |
| US8481427B2 | Method for manufacturing a micromechanical component, and micromechanical component | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.