Semiconductor devices and manufacturing methods thereof
US8692296B2 · kind B2 · utility
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1References
20Claims
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Key dates
| Filing date | Feb 9, 2012 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Feb 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices and manufacturing methods thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece with a first region having a plurality of first features and a second region having a plurality of second features proximate the first region. The first region and the second region share a patterning overlap region disposed between the first region and the second region. The patterning overlap region includes a residue feature with an aspect ratio of about 4 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.