Interposer and method for forming the same
US8692300B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jan 27, 2012 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Apr 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the invention provides an interposer which includes: a substrate having a first surface and a second surface; a first hole extending from the first surface towards the second surface; a second hole extending from the first surface towards the second surface, wherein a width of the first hole is different from a width of the second hole; an insulating layer located on the substrate and extending onto a sidewall of the first hole and a sidewall of the second hole; and a conducting layer located on the insulating layer on the substrate and extending onto the sidewall of the first hole, wherein there is substantially no conducting layer in the second hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.