Inventor · 东风镇, CN

Ming-Kun Yang

5Patents
1h-index
14Co-inventors
40Inventor score

Filing activity: Feb 9, 2011 → Dec 19, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US9559001B2 Chip package and method for forming the same Electricity 3 Active
US11456950B2 Data forwarding unit based on handle identifier Electricity 0 Active
US9711403B2 Method for forming chip package Electricity 0 Active
US8692300B2 Interposer and method for forming the same Electricity 0 Active
US10447655B2 Method for controlling transmission security of industrial communications flow based on SDN architecture Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.