Patent · US Active

Micromechanical component having a rear volume

US8692339B2 · kind B2 · utility

1Cited by

16References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jochen Reinmuth · Reutlingen, DE
Michael Saettler · Aspenhausiedlung, DE
Stefan Weiss · Trostberg, DE
Arnim Hoechst · Lörrach, DE

Key dates

Filing date	Jun 3, 2009
Grant date	Apr 8, 2014
Priority date	—
Expiry date	Sep 30, 2029

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2203/0392
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In a method for manufacturing a micromechanical component, a cavity is produced in the substrate from an opening at the rear of a monocrystalline semiconductor substrate. The etching process used for this purpose and the monocrystalline semiconductor substrate used are controlled in such a way that a largely rectangular cavity is formed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.