Semiconductor devices and methods of controlling temperature thereof
US8692349B2 · kind B2 · utility
6Cited by
0References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2011 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Dec 31, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.