Pyramid bump structure
US8692390B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2011 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | May 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pyramid bump structure for electrically coupling to a bond pad on a carrier comprises a conductive block disposed at the bond pad and an oblique pyramid insulation layer covered at one side of the conductive block. The oblique pyramid insulation layer comprises a bottom portion and a top portion, and outer diameter of the oblique pyramid insulation layer is tapered from the bottom portion to the top portion. When the carrier is connected with a substrate and an anisotropic conductive film disposed at the substrate, the pyramid bump structure may rapidly embed into the anisotropic conductive film to raise the flow rate of the anisotropic conductive film. Further, a short phenomenon between adjacent bumps can be avoided to raise the yield rate of package process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.