Semiconductor manufacturing process modules
US8696298B2 · kind B2 · utility
14Cited by
58References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2007 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Oct 16, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67748
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A variety of process modules are described for use in semiconductor manufacturing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.