Metal compound, polymerizable composition containing the same, resin, method for producing the resin, and use of the resin
US8697889B2 · kind B2 · utility
0Cited by
6References
12Claims
0Family size
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Key dates
| Filing date | May 15, 2009 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Sep 29, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B1/041
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a metal compound represented by the following formula (0):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.