Laminating system
US8698156B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2009 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Jun 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1712
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.