Metal shield structures in backside illumination image sensor chips
US8698217B2 · kind B2 · utility
3Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2012 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | May 12, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
Abstract
A device includes a semiconductor substrate having a front side and a backside. An active image sensor pixel array is disposed on the front side of the semiconductor substrate. A metal shield is disposed on the backside of, and overlying, the semiconductor substrate. The metal shield has an edge facing the active image sensor pixel array. The metal shield has a middle width, and a top width greater than the middle width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.