Kun-Ei Chen
13Patents
3h-index
20Co-inventors
60Inventor score
Filing activity: Jun 7, 2002 → Apr 26, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8034722B2 | Method of forming dual damascene semiconductor device | Electricity | 6 | Active |
| US8586486B2 | Method for forming semiconductor device | Electricity | 4 | Active |
| US8698217B2 | Metal shield structures in backside illumination image sensor chips | Electricity | 3 | Active |
| US9722076B2 | Method for manufacturing semiconductor device with contamination improvement | Electricity | 2 | Active |
| US6965432B2 | Non-invasive wafer transfer position diagnosis and calibration | Electricity | 2 | Expired |
| US12269135B2 | Work piece holder and method of transferring a work piece | Electricity | 0 | Active |
| US8900886B2 | System and method of monitoring and controlling atomic layer deposition of tungsten | Electricity | 0 | Active |
| US12424499B2 | Manufacturing method of semiconductor structure and semiconductor structure thereof | Electricity | 0 | Active |
| US11004973B2 | Semiconductor device with contamination improvement | Electricity | 0 | Active |
| US10312366B2 | Semiconductor device with contamination improvement | Electricity | 0 | Active |
| US12342564B2 | Semiconductor structure and forming method thereof | Electricity | 0 | Active |
| US12341060B2 | Method for manufacturing through vias using amorphization to adjust etching rate | Electricity | 0 | Active |
| US12080751B2 | Semiconductor device structure and methods of forming the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.