Patent · US Active

Electronic circuit arrangement with an electrical fuse

US8698275B2 · kind B2 · utility

2Cited by
11References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 25, 2006
Grant dateApr 15, 2014
Priority date
Expiry dateJun 17, 2027

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3011
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An electronic circuit arrangement has a substrate which has at least one metallization layer. At least one electrical interconnect and/or at least one via are formed in the metallization layer such that the electrical interconnect and the via are in the form of an electrical fuse link. In addition, the substrate has electrical circuit components which are arranged in the circuit layer. The circuit components are electrically coupled to one another by means of the electrical interconnect and by means of a plurality of vias.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.