Interconnection device in a multi-layer shielding mesh
US8701068B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2013 |
| Grant date | Apr 15, 2014 |
| Priority date | — |
| Expiry date | Feb 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) comprising a shielding mesh in at least one layer of the IC, the shielding mesh having a first plurality of lines which are designed to provide a first reference voltage and having a second plurality of lines which are designed to provide a second reference voltage and wherein the shielding mesh comprises a window in which signal lines are routed with less shielding than signal lines which are routed in the shielding mesh. The IC further comprising power supply lines in at least a first layer of the IC, the first layer being different than the at least one layer which contains the shielding mesh, the power supply lines being coupled to the shielding mesh and being larger in width than the first plurality of lines and the second plurality of lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.