Polishing composition and polishing method using the same
US8703007B2 · kind B2 · utility
0Cited by
18References
16Claims
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Key dates
| Filing date | Jan 20, 2011 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Jan 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition of the present invention contains an oxidant, an anticorrosive, and a surfactant comprising a compound represented by Chemical Formula 1:One to three of R1 to R5 in Chemical Formula 1 are alkyl groups, alkynyl groups, alkenyl groups, aryl groups, or arylalkylene groups, one is a hydrogen atom or an alkyl group having 1 to 9 carbon atoms, and the remainder are hydrogen atoms. O—R6 is oxyethylene, oxypropylene, or a random or block conjugate of oxyethylene and oxypropylene. n is an integer of 1 or more. X is an OSO3− group, an OPO32− group, or an OH group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.