Package on package structures and methods for forming the same
US8704354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2012 |
| Grant date | Apr 22, 2014 |
| Priority date | — |
| Expiry date | Aug 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The described embodiments of forming bonding structures for package on package involves removing a portion of connectors and molding compound of the lower package. The described bonding mechanisms enable easier placement and alignment of connectors of an upper package to with connector of a lower package. As a result, the process window of the bonding process is wider. In addition, the bonding structures have smoother join profile and planar joint plane. As a result, the bonding structures are less likely to crack and also are less likely to crack. Both the yield and the form factor of the package on package structure are improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.