Patent · US Active

Integrated circuits with magnetic core inductors and methods of fabrications thereof

US8709831B2 · kind B2 · utility

2Cited by

13References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Renate Hofmann · Regensburg, DE
Carsten Ahrens · Birkenfeld, DE
Wolfgang Klein · Zorneding, DE
Alexander Glas · Munich, DE

Key dates

Filing date	May 28, 2013
Grant date	Apr 29, 2014
Priority date	—
Expiry date	May 28, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is formed adjacent a top side of the substrate. First trenches are formed within the substrate adjacent the first inductor coil. The first trenches are filled at least partially with a magnetic fill material. At least a first portion of the substrate underlying the first inductor coil is thinned. A backside magnetic layer is formed under the first portion of the substrate. The backside magnetic layer and the magnetic fill material form at least a part of a magnetic core region of the first inductor coil.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.