Fabrication method of packaging substrate having through-holed interposer embedded therein
US8709865B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2012 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Aug 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaging substrate having a through-holed interposer embedded therein and a fabrication method of the packaging substrate are provided, where the packaging substrate includes: a molding layer having opposite first and second surfaces; a through-holed interposer embedded in the molding layer and flush with the second surface; a redistribution-layer structure embedded in the molding layer and disposed on the through-holed interposer and having a plurality of electrode pads exposed from the first surface of the molding layer; and a built-up structure disposed on the second surface of the molding layer and electrically connected to the through-holed interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.