Laser processing method and apparatus
US8709916B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2012 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Oct 15, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing method is disclosed, comprising the steps of: directing a laser beam to a workpiece; and effecting a relative motion between the laser beam and the workpiece. In particular, the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until an internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece. Further, the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece. A laser processing apparatus is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.