UV exposure method for reducing residue in de-taping process
US8710458B2 · kind B2 · utility
0Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2010 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Oct 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming an integrated circuit includes providing a wafer, and a tape adhered to the wafer, wherein the tape has a main surface perpendicular to a first direction. The tape is exposed to a light to cause the tape to lose adhesion. In the step of exposing the tape, the wafer and the tape are rotated, and/or the light is tilt projected onto the tape, wherein a main projecting direction of the light and the first direction form a tilt angle greater than zero degrees and less than 90 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.