Light-emitting device package and method of manufacturing the same
US8710513B2 · kind B2 · utility
3Cited by
1References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2012 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Jun 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.