MEMS structure and method for making the same
US8710601B2 · kind B2 · utility
2Cited by
0References
17Claims
0Family size
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Key dates
| Filing date | Nov 19, 2009 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Feb 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D48/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micro electro mechanical system (MEMS) structure is disclosed. The MEMS structure includes a backplate electrode and a 3D diaphragm electrode. The 3D diaphragm electrode has a composite structure so that a dielectric is disposed between two metal layers. The 3D diaphragm electrode is adjacent to the backplate electrode to form a variable capacitor together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.