Die packages and systems having the die packages
US8710655B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2012 |
| Grant date | Apr 29, 2014 |
| Priority date | — |
| Expiry date | Jul 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die package may include a package substrate; an interposer; and/or at least one first die connected between the package substrate and the interposer. The die package may further include at least one second die mounted on the interposer and/or a processor. A system may include a system board and/or a die package mounted on the system board. The die package may include a package substrate; an interposer; and/or at least one first die connected between the package substrate and the interposer. The system may further include at least one second die mounted on the interposer and/or a processor. The processor may control data processing operations of the at least one first die and/or the at least one second die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.