Patent · US Active

Multi-chip package with a supporting member and method of manufacturing the same

US8710677B2 · kind B2 · utility

2Cited by
5References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 4, 2012
Grant dateApr 29, 2014
Priority date—
Expiry dateAug 4, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/19107
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.