Method for fabricating miniature structures or devices such as RF and microwave components
US8713788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2011 |
| Grant date | May 6, 2014 |
| Priority date | — |
| Expiry date | Sep 4, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49018
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.