Electronic packaging apparatus and electronic packaging method
US8720519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | May 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.