Patent · US Active

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

US8723192B2 · kind B2 · utility

18Cited by

4References

6Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Karl Weidner · Birkenfeld, DE
Ralph Wirth · Lappersdorf, DE
Axel Kaltenbacher · Ingolstadt, DE
Walter Wegleiter · Nittendorf, DE
Bernd Barchmann · Regensburg, DE
Oliver Wutz · Regensburg, DE
Jan Marfeld · Regensburg, DE

Key dates

Filing date	Jul 19, 2010
Grant date	May 13, 2014
Priority date	—
Expiry date	Jul 19, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/853
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier; shaping a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body covers all side areas of the at least one optoelectronic semiconductor chip, and wherein a surface facing away from the carrier at the top side and/or a surface facing the carrier at the underside of the at least one semiconductor chip remains substantially free of the shaped body or is exposed, and removing the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.