Multi-chip module power clip
US8723300B2 · kind B2 · utility
6Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2012 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Aug 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/517
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The multi-chip leadless module 200 has integrated circuit (IC) 150, dual n-channel mosfet 110, IC leads 210, 211, 212, gate leads 213, 213, and source leads 217-220 encapsulated in resin 250. The IC 150 and the dual n-channel mosfet 110 are mounted face down on the leads. IC leads 210, 211, 212 are made of planar metal and connect, respectively, to the electrodes TEST, VDD and VM on the IC 150 using a flip chip technique to assemble the leads on copper pillars or copper studs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.