Patent · US Active

Probe head formation methods employing guide plate raising assembly mechanism

US8723538B2 · kind B2 · utility

6Cited by
5References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 17, 2011
Grant dateMay 13, 2014
Priority date—
Expiry dateMay 14, 2032

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2889
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An assembly includes a lower guide plate having a first plurality of through-holes therein, and an upper guide plate over the lower guide plate. The upper guide plate includes a second plurality of through-holes therein. The assembly further includes a plurality of probe pins. Each of the probe pins is inserted through one of the first plurality of through-holes and one of the second plurality of through-holes. The assembly further includes a plurality of probe pin stoppers, each attached to one of the probe pins, wherein the plurality of probe pin stoppers has lateral sizes greater than lateral sizes of the second plurality of through-holes. The plurality of probe pin stoppers is located over the upper guide plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.