Wraparound assembly for combination touch, handwriting and fingerprint sensor
US8724038B2 · kind B2 · utility
76Cited by
167References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2011 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Feb 9, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.