Patent · US Active

Data carrier for contactless data transmission and a method for producing such a data carrier

US8724340B2 · kind B2 · utility

1Cited by

8References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Juergen Hoegerl · Regensburg, DE
Martin Buchsbaum · Graz, AT
Frank Pueschner · Kelheim, DE
Stephan Rampetzreiter · Graz, AT

Key dates

Filing date	Apr 5, 2012
Grant date	May 13, 2014
Priority date	—
Expiry date	Oct 26, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1056
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Data carrier for contactless data transmission comprising a substrate, a chip having at least one connection pad, wherein the chip is arranged by its side remote from the connection pad on the substrate and a first copper-coated prepreg layer is arranged on the chip and at least partly on the substrate and has a contact opening to the connection pad. A plated-through hole is situated within the contact opening for producing an electrically conductive connection between the connection pad of the chip and the copper layer of the first copper-coated prepreg layer, wherein a first antenna structure is formed in the copper layer of the first copper-coated prepreg layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.