Optical module design in an SFP form factor to support increased rates of data transmission
US8727793B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2011 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Mar 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A small form-factor pluggable (SFP) module includes a board with an end portion to be inserted into a connector device. A first set of signal pads is arranged along an edge of a first surface of the SFP board at the end portion and a second set of signal pads along an edge of a second surface of the SFP board at the end portion. A third set of signal pads is disposed on the second surface at the end portion, offset from the edge of the second surface. A transceiver, coupled to the signal pads of the first, second, and third sets of signal pads, is configured to transmit and receive signals via the third set of signal pads and to transmit and receive signals via at least one of the first and second sets of signal pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.