Methods of conditioning a planarizing pad
US8727835B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2013 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Sep 23, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.