Flip-chip wafer level package and methods thereof

US8729714B1 · kind B1 · utility

Assignee

• Intel Mobile Communications GmbH · DE

Inventor

• Thorsten Meyer · Regensburg, DE

Key dates

• Filing date: Dec 31, 2012
• Grant date: May 20, 2014
• Expiry date: Dec 31, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic package includes a flip-chip component having a first die coupled to a flip-chip substrate, second die stacked on the first die, an encapsulation compound formed around the first die and the second die, a set of through encapsulant vias (TEVs) providing a set of electrical connections from a first side of the electronic package to a second side of the electronic package through the encapsulation compound to the flip-chip substrate, and a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package.