Fluid-cooled module for integrated circuit devices
US8730673B2 · kind B2 · utility
8Cited by
23References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 20, 2012 |
| Grant date | May 20, 2014 |
| Priority date | — |
| Expiry date | Jul 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.