Waveguide integration on laser for alignment-tolerant assembly

US8731346B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Jia-Hung Tseng · Portland, US
• Peter L. D. Chang · Portland, US
• Miriam Reshotko · Portland, US
• Ibrahim Ban · Beaverton, US
• Mauro J. Kobrinsky · Portland, US
• Brian Corbett · Cork, IE
• Roberto Pagano · Terlizzi, IT

Key dates

• Filing date: Jun 28, 2012
• Grant date: May 20, 2014
• Expiry date: Jun 28, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12042
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a substrate, a laser device formed on the substrate, the laser device including an active layer configured to emit light, and a mode-expander waveguide disposed on the substrate and butt-coupled with the active layer to receive and route the light to a waveguide formed on another substrate. Other embodiments may be described and/or claimed.