Solder deposition and thermal processing of thin-die thermal interface material
US8733620B2 · kind B2 · utility
7Cited by
2References
7Claims
0Family size
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Key dates
| Filing date | Dec 8, 2005 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Jun 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01327
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder is deposited on a heat sink. The solder is first reflowed at a first temperature that is below about 120° C. The solder is second heat aged at a temperature that causes the first reflowed solder to have an increased second reflow temperature. The heat aging process results in less compressive stress in a die that uses the solder as a thermal interface material. The solder can have a composition that reflows and adheres to the die and the heat sink without the use of organic fluxes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.