Calibration of an on-die thermal sensor
US8734006B2 · kind B2 · utility
9Cited by
9References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 2, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Jan 29, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of calibrating a thermal sensor includes setting a wafer to a control temperature. The wafer includes the thermal sensor and other chip logic. The method also includes applying power exclusively to a thermal sensor circuit, calibrating the thermal sensor, and storing a calibration result. The method also includes retrieving the calibration result upon application of power to the other chip logic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.