Substrate treatment apparatus and substrate treatment method
US8734593B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Mar 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treatment apparatus includes: substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having a first opposing face to be opposed to a region of a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the first opposing face for filling a space defined between the lower surface of the substrate and the first opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.