Method of contacting a doping region in a semiconductor substrate
US8735289B2 · kind B2 · utility
0Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2010 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Jun 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/645
Abstract
According to an embodiment, a method for manufacturing a semiconductor device is provided. The method includes providing a mask layer which is used as an implantation mask when forming a doping region and which is used as an etching mask when forming an opening and a contact element formed in the opening. The contact element is in contact with the doping region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.