Light emitting diode package with optical element

US8735920B2 · kind B2 · utility

Assignee

• Cree, Inc. · US

Inventors

• James Ibbetson · Lompoc, US
• Eric Tarsa · Goleta, US
• Michael Leung · Goleta, US
• Maryanne Becerra · Lompoc, US
• Bernd Keller · Lompoc, US

Key dates

• Filing date: Jul 31, 2006
• Grant date: May 27, 2014
• Expiry date: Jul 31, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/855

Abstract

A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.