Semiconductor package
US8736031B2 · kind B2 · utility
8Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Dec 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.