Lead-frame circuit package
US8736034B2 · kind B2 · utility
3Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2005 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Nov 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device.In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.