Semiconductor device having a pad
US8736067B2 · kind B2 · utility
2Cited by
16References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2011 |
| Grant date | May 27, 2014 |
| Priority date | — |
| Expiry date | Nov 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a first insulating film formed on a substrate; a pad embedded in the first insulating film; and a second insulating film that is formed on the first insulating film and has an opening exposing at least part of the pad. The pad includes a plurality of pad interconnects, and an interconnect link is provided to electrically connect adjacent interconnects among the plurality of pad interconnects. The width of the pad interconnects is smaller than the height of the pad interconnects and larger than the width of the interconnect link.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.