Device and method for hot embossing of a polymer layer
US8741204B2 · kind B2 · utility
1Cited by
11References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 2010 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Jun 17, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7562
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a device for hot embossing of a magnetic nanoparticle (N)-containing polymer layer and a method for hot embossing of a magnetic nanoparticle-containing polymer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.