Metallic surface enhancement
US8741390B2 · kind B2 · utility
5Cited by
74References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2008 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Jan 4, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.