Cai Wang
8Patents
2h-index
20Co-inventors
47Inventor score
Filing activity: Jan 7, 2005 → May 6, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7670950B2 | Copper metallization of through silicon via | Electricity | 33 | Active |
| US8741390B2 | Metallic surface enhancement | Emerging Cross-Sectional Technologies | 5 | Active |
| US10103029B2 | Process for filling vias in the microelectronics | Electricity | 1 | Active |
| US7330182B2 | 3D graphics processing method | Physics | 1 | Expired |
| US10541140B2 | Process for filling vias in the microelectronics | Electricity | 0 | Active |
| US8098264B2 | Method and apparatus for rendering computer graphics primitive | Physics | 0 | Active |
| US10221496B2 | Copper filling of through silicon vias | Electricity | 0 | Active |
| US9175400B2 | Immersion tin silver plating in electronics manufacture | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.